Face recognition temperature measurement
Face recognition temperature measurement has the characteristics of non-contact, non-inductive recognition, convenience and efficiency, and improves the security prevention and control for the realization of precise management of personnel. The R32D motherboard of Xinhua Intelligent Control is combined with the precise infrared temperature measurement module and face recognition. Algorithm, it can realize the two-in-one function of face recognition and non-contact temperature measurement.
Based on infrared thermal imaging technology and face recognition technology, the ZK-R32D motherboard is externally connected with an infrared non-contact temperature measurement module and a face recognition camera. information. At the same time, it uses the algorithm based on face key point detection and image infrared temperature dot matrix temperature analysis, which can automatically eliminate factors that interfere with human body temperature measurement. It only measures the temperature of the forehead of the face. A high-definition display can be configured to simultaneously display portraits and body temperature detection data. , so that the face and temperature can be seen instantly, thus solving the problem that the original thermal imaging temperature measurement can only see the temperature and not see the person. It can be used as a face mask to better prevent cross-infection.
The most important thing is that this solution uses a non-contact, reliable, efficient and non-aware way to target floating personnel whose body temperature exceeds a certain threshold. The system will issue an abnormal warning to help staff quickly locate feverish personnel and their close contacts, and conduct Intercept to initiate further confirmatory testing and medical observation to curb the spread of the novel coronavirus.
CPU | Rockchip RK3288 1.6GHz Cortex-A17 Quad Core GPU Mail-T764 |
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GPU | Mali-T764 GPU, supports AFBC (frame buffer compression), supports OpenGL ES 1.1/2.0/3.1, OpenCL, DirectX9.3, embedded high-performance 2D acceleration hardware |
Memory | DDR3 2GB, maximum support 4GB |
Built-in memory | EMMC 8G, up to 128GB |
Memory expansion | Support up to 128GB TF card expansion |
USB port | 6 USB 2.0 (including 1 USB OTG) |
Serial port | 4 serial ports, default TTL (optional RS232); UART4 can be optional 485 |
I2C interface | 1 standard I2C interface, the communication level is 3.3V, which can be used for touch and communication |
GPIO interface | 4 GPIO ports, the communication level is 3.3V, and the GPIO level can be 5V/12V |
Camera interface | 1 MIPI camera interface, maximum support 1300W pixels |
Gravity sensing support | Onboard G-sensor (reserved function, optional) |
Timer switch | Support |
Real Time Clock | Support |
Ethernet | 1 standard RJ45 interface, 10/100M adaptive Ethernet |
Wi-Fi/Bluetooth | With WIFI module, default 2.4GWIFI (BT and 5GWIFI optional) |
Mobile network | 1 built-in MINI PCI_E socket slot, expansion connection 3G/4G module |
LVDS output | 1 DuPont head 30p double-row pin socket (support single/dual 6/8 bit) maximum support 1920*1080 resolution |
EDP output | 1 DuPont head 20p double-row header, maximum support 2K screen |
HDMI output | 1 HDMI high-definition seat 19Pin female seat A type, support 4K/1080P output |
Speaker output | Left and right dual channel output, maximum support 8R*5W/4R*10W dual speakers, default 8R*1.5W/4R*3W |
Headphone socket | 1 channel audio dual-channel output (analog signal output) |
Microphone interface | Microphone interface 1 channel microphone mono input (analog signal input) |
Operating system | Android 7.1/5.1 |
Power outlet | 1 external DC12V input socket (DC-5.5*2.0MM female), one 2.54mm-4P input socket |
Power Adapter | Input: AC100-240V.50-60HZ, Output: DC12V 3A (depending on the screen) |
System Upgrade | Support PC/U disk/TF card upgrade |